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Qualcomm / ARM / HTC / Ericsson

Mr. Steve Mollenkopf
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  • Bachelor of Science in electrical engineering from Virginia Tech
  • Master of Science in electrical engineering from the University of Michigan at Ann Arbor

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  • Steve Mollenkopf serves as president and chief operating officer of Qualcomm Incorporated, leading the Company's divisions, business operations, market expansion and development areas. Mollenkopf provides executive oversight to current and future technology development activities, further strengthening the Company's ability to successfully navigate an increasingly complex and competitive market. He also serves as a member of Qualcomm's executive committee, helping to drive Qualcomm's overall global strategy.

    Since 2008, Mollenkopf led QCT and served as executive vice president and group president of Qualcomm, driving growth and providing critical technical and operational leadership. QCT is the world's largest wireless chip supplier and fabless semiconductor company, in terms of revenue.

    Under Mollenkopf's leadership, QCT also completed the $3B acquisition of Atheros, the Company's largest acquisition to date, to accelerate the expansion of Qualcomm's technologies and platforms to new businesses beyond cellular and provide access to significant new growth opportunities.

    Mollenkopf joined Qualcomm in 1994 as an engineer and was a leading contributor to the Globalstar project before joining the QCT team in 1999. He played a central role in developing QCT's roadmap and led the development and commercialization of the 3GPP family of air interface technologies. His technical and business leadership have also been critical to the development and implementation of multiple industry-leading innovations.

    A published IEEE author, Mollenkopf holds patents in areas such as power estimation and measurement, multi-standard transmitter system and wireless communication transceiver technology. He serves on the Board of Directors for the Semiconductor Industry Association and also serves as Co-Chairman of the Global Semiconductor Alliance Board of Directors to include their Executive Committee and CEO Council.
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Mr. Ian Drew
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  • Benjamin Ho is the Chief Marketing Officer of HTC. He assumed this role in January 2013, and is responsible for driving global marketing and branding strategies for HTC, with accountability for consumer marketing, media, insights, and marketing talent development.

    Previously he served as Executive Vice President of Business Strategy and Marketing at Far EasTone Telecommunication, where he led the company's marketing initiatives. While at Far EasTone telecommunication, Benjamin also served as a Board Director on the Conexus Mobile Alliance and Chairman of Data Express. He has served as Vice President and Chief Marketing Officer at Motorola Asia Pacific Ltd., as well as Director at BBDO Greater China, Dentsu and Young and Rubicam International.

    Benjamin earned a Business Studies and Marketing Diploma at Stamford College in Singapore.



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Qualcomm / TSMC

Mr. Anand Chandrasekher
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  • Bachelor's degree in computer science from Cornell University
  • Master's in operations research from Cornell University
  • Master of Business Administration from Cornell University Johnson Graduate School of Management.

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  • As senior vice president and chief marketing officer of Qualcomm Incorporated, Anand Chandrasekher oversees global marketing and external communications.

    Prior to joining Qualcomm, Chandrasekher was senior vice president at Intel Corporation in charge of the Ultra Mobility Group and the Intel Atom™ processor family. During his 24 year tenure at Intel, Chandrasekher held a variety of roles including co-head of Intel's Mobile Platforms Group; Worldwide Sales and Marketing Group; and, the Workstation Platforms Group. He is best known for his pioneering efforts on the Intel Centrino™ platforms which helped usher in the modern era of mobility.




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  • BJ joined TSMC as Senior Director of Advanced Technology Marketing Division in April 2009, where she was in charge of advanced technology roadmap and technology definition for 28/20 nm for high performance and low power applications. In March 2013, she was appointed as Director of Business development Division where she is the head of entire business development organization, and reported directly to Co-COO's, and served as strategic staff to CEO.

    Prior to joining TSMC, BJ has spent most of her career life in Intel Corp for 24+ years. In the 1980's, BJ concentrated on non-volatile technology development, and accumulated 13 patents for her work. In the 1990's and early 2000's, BJ shifted her focus into driving Intel's microprocessor performance and cost, leading teams to push microprocessor GHz clock speed and new generation of silicon technology.

    In 2002, BJ took a career excursion, and joined Grace Semiconductor in Shanghai as Vice President of technology development. She started from scratch and built a technology development organization in a brand new foundry.

    In 2004, BJ moved back to the US and rejoined Intel as Director of technology integration and development, responsible for driving multiple leading edge non-volatile-memory technologies, and defining technology roadmap for NOR flash. Because of her excellent work and leadership, she was nominated by Intel and was honored as 2006 Hall of Fame for WITI (women-in-technology-international).

    BJ received her B.S. from National Taiwan University, and her PhD from University of Southern California.